Impact of CMP consumables on copper metallization reliability

Yaw S. Obeng; Jeff E. Ramsdell; Sameer Deshpande; Suresh C. Kuiry; Karima Chamma; Kathleen A. Richardson; Sudipta Seal

doi:10.1109/TSM.2005.858457

Impact of CMP consumables on copper metallization reliability

Yaw S. Obeng, Jeff E. Ramsdell, Sameer Deshpande, Suresh C. Kuiry, Karima Chamma, Kathleen A. Richardson, Sudipta Seal

Appalachian State University

Texas Instruments

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	IEEE Transactions on Semiconductor Manufacturing
Volume	18
DOIs	https://doi.org/10.1109/TSM.2005.858457
State	Published - Nov 1 2005

Disciplines

Materials Science and Engineering
Electrical and Electronics

Access to Document

10.1109/TSM.2005.858457License: Unspecified

Cite this

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title = "Impact of CMP consumables on copper metallization reliability",

author = "Obeng, \{Yaw S.\} and Ramsdell, \{Jeff E.\} and Sameer Deshpande and Kuiry, \{Suresh C.\} and Karima Chamma and Richardson, \{Kathleen A.\} and Sudipta Seal",

note = "Over the past few years, the chemical mechanical planarization (CMP) community has systematically characterized the device reliability issues associated wi",

year = "2005",

month = nov,

day = "1",

doi = "10.1109/TSM.2005.858457",

language = "American English",

volume = "18",

journal = "IEEE Transactions on Semiconductor Manufacturing",

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T1 - Impact of CMP consumables on copper metallization reliability

AU - Obeng, Yaw S.

AU - Ramsdell, Jeff E.

AU - Deshpande, Sameer

AU - Kuiry, Suresh C.

AU - Chamma, Karima

AU - Richardson, Kathleen A.

AU - Seal, Sudipta

N1 - Over the past few years, the chemical mechanical planarization (CMP) community has systematically characterized the device reliability issues associated wi

PY - 2005/11/1

Y1 - 2005/11/1

UR - http://ieeexplore.ieee.org/document/1528585/

U2 - 10.1109/TSM.2005.858457

DO - 10.1109/TSM.2005.858457

M3 - Article

VL - 18

JO - IEEE Transactions on Semiconductor Manufacturing

JF - IEEE Transactions on Semiconductor Manufacturing

ER -