Impact of CMP consumables on copper metallization reliability

Yaw S. Obeng; Jeff E. Ramsdell; Sameer Deshpande; Suresh C. Kuiry; Karima Chamma; Kathleen A. Richardson; Sudipta Seal

doi:10.1109/TSM.2005.858457

Impact of CMP consumables on copper metallization reliability

Yaw S. Obeng
, Jeff E. Ramsdell
, Sameer Deshpande
, Suresh C. Kuiry
, Karima Chamma
, Kathleen A. Richardson
, Sudipta Seal

Appalachian State University

Texas Instruments

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	IEEE Transactions on Semiconductor Manufacturing
Volume	18
DOIs	https://doi.org/10.1109/TSM.2005.858457
State	Published - Nov 1 2005

Disciplines

Materials Science and Engineering
Electrical and Electronics

Access to Document

10.1109/TSM.2005.858457License: Unspecified

Cite this

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title = "Impact of CMP consumables on copper metallization reliability",

author = "Obeng, \{Yaw S.\} and Ramsdell, \{Jeff E.\} and Sameer Deshpande and Kuiry, \{Suresh C.\} and Karima Chamma and Richardson, \{Kathleen A.\} and Sudipta Seal",

note = "Over the past few years, the chemical mechanical planarization (CMP) community has systematically characterized the device reliability issues associated wi",

year = "2005",

month = nov,

day = "1",

doi = "10.1109/TSM.2005.858457",

language = "American English",

volume = "18",

journal = "IEEE Transactions on Semiconductor Manufacturing",

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T1 - Impact of CMP consumables on copper metallization reliability

AU - Obeng, Yaw S.

AU - Ramsdell, Jeff E.

AU - Deshpande, Sameer

AU - Kuiry, Suresh C.

AU - Chamma, Karima

AU - Richardson, Kathleen A.

AU - Seal, Sudipta

N1 - Over the past few years, the chemical mechanical planarization (CMP) community has systematically characterized the device reliability issues associated wi

PY - 2005/11/1

Y1 - 2005/11/1

UR - http://ieeexplore.ieee.org/document/1528585/

U2 - 10.1109/TSM.2005.858457

DO - 10.1109/TSM.2005.858457

M3 - Article

VL - 18

JO - IEEE Transactions on Semiconductor Manufacturing

JF - IEEE Transactions on Semiconductor Manufacturing

ER -